logo

Highly Efficient and Lightweight Input/output Open Silicon

Location: France

Source: EU Funding & Tenders Portal

Project
Ongoing

SiPearl was spun off from the European Processor Initiative (EPI) with €7.4m of initial funding to develop high-end microprocessors and protect European chip sovereignty. In the past 2 years, SiPearl has partnered and contracted with Arm and other top-tier IP providers, secured a €4.6M order book and identified a €1.1Bn sales pipeline in Europe alone. SiPearl is currently raising an €80M+ Series A

Project Information FAQ

Project Information

3 Q
The project “Highly Efficient and Lightweight Input/output Open Silicon” is an infrastructure initiative, located in France. Taiyo aggregates data on it from EU Funding & Tenders Portal.

Want to explore the full details? View the full report

Participants

Sponsoring Agency

Obfuscated Data

Company

Obfuscated Data

Status

Original status

ongoing

Taiyo status

Obfuscated Data

Taiyo last update

00-00-0000

Available timestamps

00-00-0000

Available timestamp type

Obfuscated Data

Contact

Contact name

Obfuscated Data

Phone

0000000000

Email

ObfuscatedData@email.com

Address

Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data

Description

Description

SiPearl was spun off from the European Processor Initiative (EPI) with €7.4m of initial funding to develop high-end microprocessors and protect European chip sovereignty. In the past 2 years, SiPearl has partnered and contracted with Arm and other top-tier IP providers, secured a €4.6M order book and identified a €1.1Bn sales pipeline in Europe alone. SiPearl is currently raising an €80M+ Series A. We are confident to close this round by year-end based on the achievements of the past 3 months: lead term sheet from a lead corporate investor of our industry, 25M€ venture loan from the EIB, €15M follow-on grant from EPI and additional LOIs from several corporate and public investors. We are currently hiring 7-10 employees per month in Europe. This funding application relates to an additional €2.5M EIC grant + €15M EIC equity which is meant to support the development of our next generation HELIOS platform architecture that supports the new European Chips Act by reducing the cost and time of new chip designs.”

Original sub-sector

Obfuscated

Original Currency

USD

Original budget

000000000000000

Procurement method

Obfuscated Data

Budget

000000000000000

Location

Region

Obfuscated

Country

Obfuscated

State

Obfuscated Data

County

Obfuscated

Location

Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data

Source

Source reliability

High

Data quality score

100%

Source

Obfuscated Data

URL

obfuscated_data,obfuscateddata.com

More Details

Project Type

Obfuscated Data

Article Published Date

Obfuscated Data