ICECool Electronics Cooling Program
Sector: Aerospace & Defense • Location: Wright-Patterson AFB, Ohio, United States
Source: Military Aerospace
IBM Corp. is advancing a U.S. military research program to integrate convective or evaporative microfluidic cooling into microchip designs and packaging. This initiative aims to enhance thermal management in military electronics, thereby improving performance while reducing size, weight, and power consumption.
- Status
- Closed
- Sector
- Aerospace & Defense, Advanced Electronics, Geothermal, Government, Power Generation (CCGT)
- Location
- Wright-Patterson AFB, Ohio, United States of America
- Updated
- 22 Jul 2026
- Source
- Military Aerospace
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Project Information
Participants
Sponsoring Agency |
Status
Original status | awarded |
Taiyo status | Closed |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | IBM Corp. is advancing a U.S. military research program to integrate convective or evaporative microfluidic cooling into microchip designs and packaging. This initiative aims to enhance thermal management in military electronics, thereby improving performance while reducing size, weight, and power consumption. |
Original sector | Electronics |
Budget |
Location
Country | United States of America (USA) |
State | Ohio |
City | Wright-Patterson AFB |
Source
Source | Military Aerospace |
URL |
More Details
Record type | Project |
Sector | Aerospace & Defense, Advanced Electronics, Geothermal, Government, Power Generation (CCGT) |
Article published date | 2025-03-20 |
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