India's First 3D Glass Semiconductor Packaging Facility
Sector: Government • Location: Bhubaneswar, Odisha, India
Source: Ommcom News
This project involves the establishment of India's first glass substrate-based chip packaging facility in Odisha. It will deploy cutting-edge 3D glass-based semiconductor packaging technology to manufacture advanced 3D heterogeneous integration modules for sectors like aerospace, defence, AI, 5G communications, and data centres. The facility aims to produce nearly 50 million assembled semiconducto
- Status
- Prospective
- Sector
- Government, Aerospace & Defense, Advanced Electronics, Manufacturing (Industrial)
- Location
- Bhubaneswar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- Ommcom News
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Project Information
Participants
| Not available for this record. |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | This project involves the establishment of India's first glass substrate-based chip packaging facility in Odisha. It will deploy cutting-edge 3D glass-based semiconductor packaging technology to manufacture advanced 3D heterogeneous integration modules for sectors like aerospace, defence, AI, 5G communications, and data centres. The facility aims to produce nearly 50 million assembled semiconductor units annually and generate around 2,500 jobs. |
Original sector | Electronics |
Budget |
Location
Country | India |
State | Odisha |
City | Bhubaneswar |
Source
Source | Ommcom News |
URL |
More Details
Record type | Project |
Sector | Government, Aerospace & Defense, Advanced Electronics, Manufacturing (Industrial) |
Article published date | 2026-04-21 |
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