India's First Advanced 3D Chip Packaging Unit
Sector: Advanced Electronics • Location: Odisha, India
Source: MSN
The foundation stone has been laid for India's first advanced 3D chip packaging unit located in Odisha's Info Valley. This project aims to establish a state-of-the-art facility for advanced semiconductor packaging technology.
- Status
- Prospective
- Sector
- Advanced Electronics, Manufacturing (Industrial)
- Location
- Odisha, India
- Updated
- 22 Jul 2026
- Source
- MSN
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Project Information
Participants
| Not available for this record. |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | The foundation stone has been laid for India's first advanced 3D chip packaging unit located in Odisha's Info Valley. This project aims to establish a state-of-the-art facility for advanced semiconductor packaging technology. |
Original sector | Technology Infrastructure |
Location
Country | India |
State | Odisha |
Source
Source | MSN |
URL |
More Details
Record type | Project |
Sector | Advanced Electronics, Manufacturing (Industrial) |
Article published date | 2026-04-24 |
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