India's First Advanced 3D Glass Semiconductor Packaging Unit
Sector: Government • Location: Bhubaneswar, Odisha, India
Source: The Times of India
The project involves setting up India's first advanced 3D glass semiconductor packaging unit in Bhubaneswar, Odisha. The facility will be established by Heterogeneous Integration Packaging Solutions (3D Glass Solutions) and aims to bring advanced chip packaging technology to India, create about 2,500 jobs, and strengthen Odisha's position in the global semiconductor landscape. The plant will have
- Status
- Prospective
- Sector
- Government, Aerospace & Defense, Advanced Electronics, Manufacturing (Industrial)
- Location
- Bhubaneswar, Odisha, India
- Updated
- 22 Jul 2026
- Source
- The Times of India
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Project Information
Participants
| Not available for this record. |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | The project involves setting up India's first advanced 3D glass semiconductor packaging unit in Bhubaneswar, Odisha. The facility will be established by Heterogeneous Integration Packaging Solutions (3D Glass Solutions) and aims to bring advanced chip packaging technology to India, create about 2,500 jobs, and strengthen Odisha's position in the global semiconductor landscape. The plant will have the capacity to produce 50 million assembled units annually and will serve sectors such as aerospace, defence, AI, 5G, and data centres. |
Original sector | Technology |
Budget |
Location
Country | India |
State | Odisha |
City | Bhubaneswar |
Source
Source | The Times of India |
URL |
More Details
Record type | Project |
Sector | Government, Aerospace & Defense, Advanced Electronics, Manufacturing (Industrial) |
Article published date | 2026-04-21 |
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