India's First Advanced Semiconductor Substrate Facility in Odisha

planned

Intel Corporation and 3D Glass Solutions (3DGS) are exploring a $3.3-billion investment in Odisha to set up India’s first advanced semiconductor glass core packaging substrate manufacturing facility. The project will focus on advanced glass-based substrates and high-density interconnect packaging technologies used in AI, high-performance computing, telecommunications, and next-generation electronics. The facility will include cleanrooms, fabrication units, testing infrastructure, and R&D facilities. Intel will provide technology partnership including process expertise, technology licensing, quality systems, and workforce capability development.