Infinera Advanced Test and Packaging Facility
Sector: Advanced Electronics • Location: Bethlehem, Pennsylvania, United States
Source: National Institute of Standards and Technology
Infinera is constructing a new advanced test and packaging facility in Bethlehem, Pennsylvania, supported by up to $93 million in funding from the U.S. Department of Commerce. This facility will enhance the domestic fabrication and testing of indium phosphide-based photonic circuits, crucial for telecommunications and national security.
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Participants
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Company | Obfuscated Data |
Status
Original status | Awarded |
Taiyo status | Obfuscated Data |
Taiyo last update | 00-00-0000 |
Available timestamps | 00-00-0000 |
Available timestamp type | Obfuscated Data |
Contact
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Phone | 0000000000 |
ObfuscatedData@email.com | |
Address | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Description
Description | Infinera is constructing a new advanced test and packaging facility in Bethlehem, Pennsylvania, supported by up to $93 million in funding from the U.S. Department of Commerce. This facility will enhance the domestic fabrication and testing of indium phosphide-based photonic circuits, crucial for telecommunications and national security. |
Original sub-sector | Obfuscated |
Original Currency | USD |
Original budget | 000000000000000 |
Procurement method | Obfuscated Data |
Budget | 000000000000000 |
Location
Region | Obfuscated |
Country | Obfuscated |
State | Obfuscated Data |
County | Obfuscated |
Location | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Source
Source reliability | High |
Data quality score | 100% |
Source | Obfuscated Data |
URL | obfuscated_data,obfuscateddata.com |
More Details
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