logo

Intel Fab 52 Semiconductor Manufacturing Facility

Sector: Advanced Electronics • Location: Hillsboro, Oregon, United States

Source: Wccftech

Project
Operational

Intel Fab 52 is a state-of-the-art semiconductor fabrication plant in the US that became operational last year. It is responsible for producing Panther Lake chips using the advanced 18A process technology. This fab is part of Intel's 'Made-in-US' policy and is one of several planned fabs in the US to support advanced chip manufacturing and supply contracts, including a $151 billion US Defense prog

Status
Under Construction
Sector
Advanced Electronics, Aerospace & Defense, Government, Manufacturing (Industrial)
Location
Hillsboro, Oregon, United States of America
Updated
22 Jul 2026
Source
Wccftech

ConstructChat

Ask ConstructChat about Intel Fab 52 Semiconductor Manufacturing Facility

Pick a question to edit it, or write your own.

First answer free · no account

I am a

Project Information FAQ

Project Information

3 Q
The project “Intel Fab 52 Semiconductor Manufacturing Facility” is an infrastructure initiative in the Advanced Electronics sector, located in Hillsboro, Oregon, United States. Taiyo aggregates data on it from Wccftech.

Participants

Not available for this record.

Status

Original status

operational

Taiyo status

Under Construction

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

Intel Fab 52 is a state-of-the-art semiconductor fabrication plant in the US that became operational last year. It is responsible for producing Panther Lake chips using the advanced 18A process technology. This fab is part of Intel's 'Made-in-US' policy and is one of several planned fabs in the US to support advanced chip manufacturing and supply contracts, including a $151 billion US Defense program.

Original sector

Technology

Location

Country

United States of America (USA)

State

Oregon

City

Hillsboro

Source

Source

Wccftech

URL

More Details

Record type

Project

Sector

Advanced Electronics, Aerospace & Defense, Government, Manufacturing (Industrial)

Article published date

2026-05-11

More on this project

Research

Free account

View all details

You are reading the public part. A free account opens the rest:

  • Every detail on this project
  • News and media coverage
  • Technical research
View all details

Free account · no card · lands you back on this project