Intrachip/Interchip Enhanced Cooling Fundamentals (ICECool Fundamentals)
Sector: Advanced Electronics • Location: United States of America
Source: Grants.gov
Amendment 01: The purpose of this Amendment is to revise the full proposal due date and to make technical revisions as highlighted in yellow in the attached conformed DARPA-BAA-12-50 document.
Original Synopsis below.
The ICECool Fundamentals thrust is the first step toward achieving the goals of the ICECool program and will develop the fundamental building blocks of intra- and interchip e
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Status
Original status | archived |
Taiyo status | Obfuscated Data |
Taiyo last update | 00-00-0000 |
Available timestamps | 00-00-0000 |
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Description
Description | Amendment 01: The purpose of this Amendment is to revise the full proposal due date and to make technical revisions as highlighted in yellow in the attached conformed DARPA-BAA-12-50 document. Original Synopsis below. The ICECool Fundamentals thrust is the first step toward achieving the goals of the ICECool program and will develop the fundamental building blocks of intra- and interchip evaporative microfluidic cooling. ICECool Fundamentals will develop and demonstrate the microfabrication techniquesneeded to implement evaporative microfluidics in multiply-microchanneled semiconductor wafers and study, model, and correlate the thermofluidic characteristics of evaporative flows in such microchannel flow loops within individual chips and/or in the microgaps between chips in 3D stacks. See the full DARPA-BAA-12-50 document attached. |
Original sub-sector | Obfuscated |
Original Currency | USD |
Original budget | 000000000000000 |
Procurement method | Obfuscated Data |
Budget | 000000000000000 |
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Source
Source reliability | High |
Data quality score | 100% |
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URL | obfuscated_data,obfuscateddata.com |
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