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Magnetic Miniaturized and Monolithically-Integrated Components (M3IC)

Sector: Advanced Electronics • Location: United States of America

Source: Grants.gov

Project
Archived

The DARPA Microsystems Technology Office is soliciting innovative research proposals to develop integrated magnetic components on semiconductor substrates that will reduce size and enable new functionality for U.S. Department of Defense (DoD) electromagnetic (EM) systems. Proposals will focus on one or more of the following technical areas: 1) integration of magnetic components on semiconductor

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The project “Magnetic Miniaturized and Monolithically-Integrated Components (M3IC)” is an infrastructure initiative in the Advanced Electronics sector, located in United States of America. Taiyo aggregates data on it from Grants.gov.

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Description

Description

The DARPA Microsystems Technology Office is soliciting innovative research proposals to develop integrated magnetic components on semiconductor substrates that will reduce size and enable new functionality for U.S. Department of Defense (DoD) electromagnetic (EM) systems. Proposals will focus on one or more of the following technical areas: 1) integration of magnetic components on semiconductor substrates, 2) modeling the system-level impact of nonlinear, non-reciprocal, time-dependent magnetic phenomena, and 3) optimization of miniaturized microwave magnetic components. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.

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High

Data quality score

100%

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