Metallised Encapsulant for Silicon PV Modules

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The Metallised Encapsulant for Silicon PV Modules project will develop an innovative module fabrication technology where conductors are directly electroformed in laser-structured encapsulant surfaces.The developed technology can increase module fabrication flexibility, with manufacturers able to purchase pre-fabricated metallised encapsulant for module lamination. The project aims to reducing the levelised cost of electricity of silicon photovoltaicsby: (i) using low-cost materials; (ii) increasing efficiency through elimination of cell busbars and introducing high aspect ratio conductors; and (iii) increasing module reliability by reducing stress induced through the use of interconnecting wires and ribbons.How the project worksThe Metallised Encapsulant for Silicon PV Modules project is a key initiative of researchers from the School of Photovoltaics and Renewable Energy Engineering at UNSW Sydney and builds upon their knowledge of laser structuring, electrodeposition andoptical modelling. The technology will be developed in collaboration with PV ribbon manufacturer Sizhuo PV Tech, leading PV manufacturer LONGi Solar and PV materials provider DSM Advanced Surfaces (Netherlands), with the Energy Research Centre of the Netherlands (ECN) and Australian National University (ANU) partnering on the optical modelling and laser structuring research.

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