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Micron Second Memory Fabrication Plant in Boise

Sector: Advanced Electronics • Location: Boise, Idaho, United States

Source: BoiseDev

Project
Planned

Micron Technology announced a $200 billion investment to expand domestic semiconductor manufacturing in the U.S., including a second memory fabrication plant at its headquarters in Boise, Idaho. The investment includes $150 billion for manufacturing and $50 billion for research and development. The second Boise fab, along with other planned fabs, aims to produce up to 40% of Micron's primary produ

Status
Prospective
Sector
Advanced Electronics, Manufacturing (Industrial), Water Supply and Storage, Power Generation (CCGT)
Location
Boise, Idaho, United States of America
Updated
22 Jul 2026
Source
BoiseDev

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The project “Micron Second Memory Fabrication Plant in Boise” is an infrastructure initiative in the Advanced Electronics sector, located in Boise, Idaho, United States. Taiyo aggregates data on it from BoiseDev.

Participants

Not available for this record.

Status

Original status

Planned

Taiyo status

Prospective

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

Micron Technology announced a $200 billion investment to expand domestic semiconductor manufacturing in the U.S., including a second memory fabrication plant at its headquarters in Boise, Idaho. The investment includes $150 billion for manufacturing and $50 billion for research and development. The second Boise fab, along with other planned fabs, aims to produce up to 40% of Micron's primary product in the U.S. Production output is scheduled to start in 2027. Related infrastructure improvements such as new water treatment and power facilities are also underway.

Original sector

Manufacturing

Budget

Location

Country

United States of America (USA)

State

Idaho

City

Boise

Source

Source

BoiseDev

URL

More Details

Record type

Project

Sector

Advanced Electronics, Manufacturing (Industrial), Water Supply and Storage, Power Generation (CCGT)

Article published date

2025-06-14

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