Micron U.S. DRAM Manufacturing and R&D Expansion
Sector: Advanced Electronics • Location: Boise; Manassas; New York, Idaho; Virginia; New York, United States
Source: BIC Magazine
Micron Technology plans to expand its U.S. investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D. The expansion includes building a second leading-edge memory fab in Boise, Idaho; expanding and modernizing its existing manufacturing facility in Manassas, Virginia; bringing advanced packaging capabilities to the U.S. for High Bandwidth Memory (HBM); and o
- Status
- Under Construction
- Sector
- Advanced Electronics, Commercial, Manufacturing (Industrial), Broadband, Telecommunications
- Location
- Boise; Manassas; New York, Idaho; Virginia; New York, United States of America
- Updated
- 22 Jul 2026
- Source
- BIC Magazine
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Project Information
Participants
| Not available for this record. |
Status
Original status | under construction |
Taiyo status | Under Construction |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | Micron Technology plans to expand its U.S. investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D. The expansion includes building a second leading-edge memory fab in Boise, Idaho; expanding and modernizing its existing manufacturing facility in Manassas, Virginia; bringing advanced packaging capabilities to the U.S. for High Bandwidth Memory (HBM); and ongoing plans for a megafab in New York. The investment aims to create an estimated 90,000 direct and indirect jobs and reinforce America's technological leadership in semiconductor manufacturing. |
Original sector | Technology |
Budget |
Location
Country | United States of America (USA) |
State | Idaho; Virginia; New York |
City | Boise; Manassas; New York |
Source
Source | BIC Magazine |
URL |
More Details
Record type | Project |
Sector | Advanced Electronics, Commercial, Manufacturing (Industrial), Broadband, Telecommunications |
Article published date | 2025-06-22 |
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