Moore4Power Project
Sector: Advanced Electronics • Location: European Union
Source: Semiecosystem
Moore4Power is an initiative to develop new advanced packaging techniques, specifically heterogeneous integration, for next-generation power semiconductor devices. The project aims to combine different semiconductor chip technologies such as silicon, silicon carbide (SiC), and gallium nitride (GaN) along with sensing, control, and communication functions to form integrated systems in a package, en
- Status
- Prospective
- Sector
- Advanced Electronics, Power Generation (CCGT)
- Location
- Unknown (Europe)
- Updated
- 22 Jul 2026
- Source
- Semiecosystem
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Project Information
Participants
| Not available for this record. |
Status
Original status | planned |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | Moore4Power is an initiative to develop new advanced packaging techniques, specifically heterogeneous integration, for next-generation power semiconductor devices. The project aims to combine different semiconductor chip technologies such as silicon, silicon carbide (SiC), and gallium nitride (GaN) along with sensing, control, and communication functions to form integrated systems in a package, enabling higher efficiency, improved reliability, and more compact designs. |
Original sector | Semiconductor R&D |
Budget |
Location
Country | Unknown (Europe) |
Source
Source | Semiecosystem |
URL |
More Details
Record type | Project |
Sector | Advanced Electronics, Power Generation (CCGT) |
Article published date | 2026-05-29 |
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