Multi-phase Semiconductor Fabrication Campus Project
Sector: Advanced Electronics • Location: Northeast, United States
Source: Investing.com
Sterling Infrastructure was awarded the first phase of a multi-phase semiconductor fabrication campus project, executed under a joint venture, totaling over $500 million. The project is expected to be completed in late 2027 or early 2028 and spans a multi-decade period with opportunities for additional scopes of work through 2027 and beyond.
- Status
- Under Construction
- Sector
- Advanced Electronics, Manufacturing (Industrial)
- Location
- Northeast, United States of America
- Updated
- 22 Jul 2026
- Source
- Investing.com
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Project Information
Participants
| Not available for this record. |
Status
Original status | under construction |
Taiyo status | Under Construction |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | Sterling Infrastructure was awarded the first phase of a multi-phase semiconductor fabrication campus project, executed under a joint venture, totaling over $500 million. The project is expected to be completed in late 2027 or early 2028 and spans a multi-decade period with opportunities for additional scopes of work through 2027 and beyond. |
Original sector | Infrastructure |
Budget |
Location
Country | United States of America (USA) |
State | Northeast |
Source
Source | Investing.com |
URL |
More Details
Record type | Project |
Sector | Advanced Electronics, Manufacturing (Industrial) |
Article published date | 2026-05-14 |
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