NASA's Heat Resistant Microchip Technology
Sector: Aerospace & Defense • Location: United States
Source: The Engineer
This project aims to advance the development of heat-tolerant semiconductors made of silicon carbide (SiC) that can withstand extreme temperatures and radiation levels. The initiative will scale up NASA's technology and manufacturing processes to modern wafer sizes, enhancing SiC chip design for various applications, including space exploration.
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Participants
Sponsoring Agency | Obfuscated Data |
Company | Obfuscated Data |
Status
Original status | planned |
Taiyo status | Obfuscated Data |
Taiyo last update | 00-00-0000 |
Available timestamps | 00-00-0000 |
Available timestamp type | Obfuscated Data |
Contact
Contact name | Obfuscated Data |
Phone | 0000000000 |
ObfuscatedData@email.com | |
Address | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Description
Description | This project aims to advance the development of heat-tolerant semiconductors made of silicon carbide (SiC) that can withstand extreme temperatures and radiation levels. The initiative will scale up NASA's technology and manufacturing processes to modern wafer sizes, enhancing SiC chip design for various applications, including space exploration. |
Original sub-sector | Obfuscated |
Original Currency | USD |
Original budget | 000000000000000 |
Procurement method | Obfuscated Data |
Budget | 000000000000000 |
Location
Region | Obfuscated |
Country | Obfuscated |
State | Obfuscated Data |
County | Obfuscated |
Location | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Source
Source reliability | High |
Data quality score | 100% |
Source | Obfuscated Data |
URL | obfuscated_data,obfuscateddata.com |
More Details
Project Type | Obfuscated Data |
Article Published Date | Obfuscated Data |