National Semiconductor Packaging Facility
Sector: Education • Location: Tempe, Arizona, United States
Source: India Education Diary
Arizona State University (ASU) has been selected as the site for a new National Semiconductor Packaging Facility funded by the CHIPS and Science Act. This facility aims to enhance semiconductor packaging capabilities in the United States, supporting the growing demand for advanced semiconductor technologies.
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Participants
Sponsoring Agency | Obfuscated Data |
Company | Obfuscated Data |
Status
Original status | Planned |
Taiyo status | Obfuscated Data |
Taiyo last update | 00-00-0000 |
Available timestamps | 00-00-0000 |
Available timestamp type | Obfuscated Data |
Contact
Contact name | Obfuscated Data |
Phone | 0000000000 |
ObfuscatedData@email.com | |
Address | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Description
Description | Arizona State University (ASU) has been selected as the site for a new National Semiconductor Packaging Facility funded by the CHIPS and Science Act. This facility aims to enhance semiconductor packaging capabilities in the United States, supporting the growing demand for advanced semiconductor technologies. |
Original sub-sector | Obfuscated |
Original Currency | USD |
Original budget | 000000000000000 |
Procurement method | Obfuscated Data |
Budget | 000000000000000 |
Location
Region | Obfuscated |
Country | Obfuscated |
State | Obfuscated Data |
County | Obfuscated |
Location | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Source
Source reliability | High |
Data quality score | 100% |
Source | Obfuscated Data |
URL | obfuscated_data,obfuscateddata.com |
More Details
Project Type | Obfuscated Data |
Article Published Date | Obfuscated Data |