New York Advanced Packaging and Photonics Center
Sector: Commercial • Location: New York, United States
Source: Evertiq
GlobalFoundries plans to create a new centre for advanced packaging and testing of US-made essential chips within its New York manufacturing facility. The centre aims to enable semiconductors to be securely manufactured, processed, packaged, and tested entirely within the US, addressing demands driven by advancements in AI and other critical technologies.
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Participants
Sponsoring Agency | Obfuscated Data |
Company | Obfuscated Data |
Status
Original status | Planned |
Taiyo status | Obfuscated Data |
Taiyo last update | 00-00-0000 |
Available timestamps | 00-00-0000 |
Available timestamp type | Obfuscated Data |
Contact
Contact name | Obfuscated Data |
Phone | 0000000000 |
ObfuscatedData@email.com | |
Address | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Description
Description | GlobalFoundries plans to create a new centre for advanced packaging and testing of US-made essential chips within its New York manufacturing facility. The centre aims to enable semiconductors to be securely manufactured, processed, packaged, and tested entirely within the US, addressing demands driven by advancements in AI and other critical technologies. |
Original sub-sector | Obfuscated |
Original Currency | USD |
Original budget | 000000000000000 |
Procurement method | Obfuscated Data |
Budget | 000000000000000 |
Location
Region | Obfuscated |
Country | Obfuscated |
State | Obfuscated Data |
County | Obfuscated |
Location | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Source
Source reliability | High |
Data quality score | 100% |
Source | Obfuscated Data |
URL | obfuscated_data,obfuscateddata.com |
More Details
Project Type | Obfuscated Data |
Article Published Date | Obfuscated Data |