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OH/DOT: D10 Chip Seal (Proj No; 250155)

Sector: Manufacturing (Industrial) • Location: Logan, Ohio, United States of America

Source: Dodge

Project
Closed

D10 Chip Seal FY 2025 South: HOC-180-7.32-11.92; HOC-664-0.00-2.90 and HOC-56-9.44-13.60 D10 Chip Seal FY 2025 South For Improving Various Sections In The Townships Of Laurel, Perry, And Benton, All Of Hocking County, State Of Ohio, In Accordance With The Plans And Specifications Of The Department Of Transportation By Utilizing Chip Seal To Resurface Various Two-lane Roadways Over 11.66 Miles And

Status
Closed
Sector
Manufacturing (Industrial), Road, Power Transmission, Commercial, Power Generation (CCGT)
Location
Logan, Ohio, United States of America
Updated
22 Jul 2026
Source
Dodge

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The project “OH/DOT: D10 Chip Seal (Proj No; 250155)” is an infrastructure initiative in the Manufacturing (Industrial) sector, located in Logan, Ohio, United States of America. Taiyo aggregates data on it from Dodge.

Participants

Not available for this record.

Status

Original status

closed

Taiyo status

Closed

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

D10 Chip Seal FY 2025 South: HOC-180-7.32-11.92; HOC-664-0.00-2.90 and HOC-56-9.44-13.60 D10 Chip Seal FY 2025 South For Improving Various Sections In The Townships Of Laurel, Perry, And Benton, All Of Hocking County, State Of Ohio, In Accordance With The Plans And Specifications Of The Department Of Transportation By Utilizing Chip Seal To Resurface Various Two-lane Roadways Over 11.66 Miles And All Related Work.

Procurement method

Budget

Location

Country

United States of America (USA)

State

Ohio

City

Logan

Source

Source

Dodge

URL

More Details

Record type

Project

Sector

Manufacturing (Industrial), Road, Power Transmission, Commercial, Power Generation (CCGT)

Article published date

2025-03-17

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