Protective reactive joining of micro-systems

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The cross-border challenge is that very specialist technological expertise has been built up in the field of micro-technology, on one side in the southern part of Baden-Wuerttemberg, and on the other side in the regions of Switzerland involved. On the other hand, the opportunity for networking and scientific exchange is lacking in the border region, as networks such as the leading-edge MicroTEC Südwest cluster end at the national border. By developing an innovative technological process, it is anticipated that the research and innovation capability of the region will be increased thanks to the extension of cross-border research capacities. Viewed historically, the lack of networking can also be recognised, for example, in the watch and clock industry. There is a long tradition of watch and clock production in both regions. However, the type of products have developed completely differently. On the one hand, in the Black Forest in particular, the watch and clock industry has disappeared, with a few exceptions. On the other hand, many precision engineering firms have emerged due to the expertise built up from timepiece production, and some of these have further developed into modern technology companies. In this respect, it should also be mentioned that the Hahn-Schickard company came about from the “Forschungsgesellschaft für Uhren- und Feingerätetechnik” (research company for timepieces and precision engineering) founded in 1955. It is a renowned company in the field of micro-system technology today. Since then, micro components for modern timepieces made of silicon are being produced at Hahn-Schickard once again. The customer is a timepiece manufacturer in Switzerland. This shows that there is a high potential for cross-border cooperation in the field of research and development. However, up to now there have been insufficient opportunities to extend this cooperation and implement it as added value for the Alpine Rhine-Lake Constance-High Rhine region. The complementarity of the partners are to be deployed in the context of the project, the different but interdependent experiences are to be combined, and advantageous synergetic effects achieved from this. With the development of components from micro-technology or micro-sensors, there is often the requirement for a low-stress, permanent heat-conducting joining connection with the substrate that is as good as possible. In many cases, conventional reflow solders cannot be used because, either the components cannot withstand the temperatures occurring without damage, or they are under high thermo-mechanical stress after cooling off, which has a negative effect on their characteristics. The reactive joint is one such innovative process, enabling low-stress, high-strength and good heat-conducting join connections, without putting the components under thermal stress. The reactive joint is based on a very fast-running exothermic reaction, transferring the heat for the soldering process virtually only in the area of the join, so that the components are not heated up. However, a shock wave is generated in the join area due to the rapid heating up, and this can lead to the failure of very sensitive components such as semiconductor-based sensors or Peltier elements. The objective of this project is to lessen this shock wave through suitable measures, to enable reactive join process for sensitive components. The following measures are planned to disseminate the results: - Scientific technological report on the project results - Technological transfer in a special process demonstration for companies that are interested - Workshop for the industry in the field of sensors. The anticipated effects are as follows: - Increasing institutional cooperation in the region - Technological progress in connection technology for micro-systems - Introduction of the process developed via industry partners in the region - Strengthening of the market position of industry partners.

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