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ReConnect Loan and Grant Program

Sector: Raw Materials • Location: United States

Source: Benton Institute

Project
Awarded

The ReConnect Loan and Grant Program is part of the USDA's efforts to provide broadband service in eligible rural areas. For FY24, it has been allocated $100,385,000 to support construction and improvement of broadband infrastructure.

Status
Closed
Sector
Raw Materials, Telecommunications, Broadband, Government
Location
United States of America
Updated
22 Jul 2026
Source
Benton Institute

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Project Information

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The project “ReConnect Loan and Grant Program” is an infrastructure initiative in the Raw Materials sector, located in United States. Taiyo aggregates data on it from Benton Institute.

Participants

Sponsoring Agency

Status

Original status

Awarded

Taiyo status

Closed

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

The ReConnect Loan and Grant Program is part of the USDA's efforts to provide broadband service in eligible rural areas. For FY24, it has been allocated $100,385,000 to support construction and improvement of broadband infrastructure.

Original sector

Telecommunications

Budget

Location

Country

United States of America (USA)

Source

Source

Benton Institute

URL

More Details

Record type

Project

Sector

Raw Materials, Telecommunications, Broadband, Government

Article published date

2025-03-20

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