Sahasra Semiconductors Chip Packaging Facility
Sector: Advanced Electronics • Location: Bhiwadi, Rajasthan, India
Source: IndexBox
Sahasra Semiconductors commenced commercial chip packaging at a new facility established under the SPECS scheme with an investment of over Rs150 crore (about US$15.7 million). The company plans to increase annual packaging capacity from about 100 million units to between 400 million and 600 million units in the next two to three years.
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Participants
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Company | Obfuscated Data |
Status
Original status | operational |
Taiyo status | Obfuscated Data |
Taiyo last update | 00-00-0000 |
Available timestamps | 00-00-0000 |
Available timestamp type | Obfuscated Data |
Contact
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Phone | 0000000000 |
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Address | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Description
Description | Sahasra Semiconductors commenced commercial chip packaging at a new facility established under the SPECS scheme with an investment of over Rs150 crore (about US$15.7 million). The company plans to increase annual packaging capacity from about 100 million units to between 400 million and 600 million units in the next two to three years. |
Original sub-sector | Obfuscated |
Original Currency | USD |
Original budget | 000000000000000 |
Procurement method | Obfuscated Data |
Budget | 000000000000000 |
Location
Region | Obfuscated |
Country | Obfuscated |
State | Obfuscated Data |
County | Obfuscated |
Location | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Source
Source reliability | High |
Data quality score | 100% |
Source | Obfuscated Data |
URL | obfuscated_data,obfuscateddata.com |
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