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SD/DOT: I229N Polymer Chip Seal Improvements

Sector: Mass Transit • Location: Sioux Falls, South Dakota, United States of America

Source: Dodge USA

Project
Planning Schematics

I229N I229NF I229 NF (Western Ave) - 0.1 S of I229 Interchange over Big Sioux Rv; I229N - 0.4 N of Exit 7 (Rice St) over Big Sioux Rv Polymer Chip Seal LSDC Overlay, Approach Slabs, Replace Pedestrian Rail

Status
Prospective
Sector
Mass Transit, Consumer Products, Road, Chemical (Industrial), Rail, Car parking, Commercial, Automotive, Manufacturing (Industrial)
Location
Sioux Falls, South Dakota, United States of America
Updated
22 Jul 2026
Source
Dodge USA

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Project Information

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The project “SD/DOT: I229N Polymer Chip Seal Improvements” is an infrastructure initiative in the Mass Transit sector, located in Sioux Falls, South Dakota, United States of America. Taiyo aggregates data on it from Dodge USA.

Participants

Not available for this record.

Status

Original status

Planning Schematics

Taiyo status

Prospective

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

I229N I229NF I229 NF (Western Ave) - 0.1 S of I229 Interchange over Big Sioux Rv; I229N - 0.4 N of Exit 7 (Rice St) over Big Sioux Rv Polymer Chip Seal LSDC Overlay, Approach Slabs, Replace Pedestrian Rail

Procurement method

Budget

Location

Country

United States of America (USA)

State

South Dakota

City

Sioux Falls

Source

Source

Dodge USA

URL

More Details

Record type

Project

Sector

Mass Transit, Consumer Products, Road, Chemical (Industrial), Rail, Car parking, Commercial, Automotive, Manufacturing (Industrial)

Article published date

2024-10-14

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