SHIELD USA Project
Sector: Advanced Electronics • Location: Tempe, Arizona, United States
Source: ASU News - Arizona State University
The SHIELD USA project aims to strengthen U.S. semiconductor packaging capabilities by driving innovation in the domestic microchip packaging ecosystem and expanding capacity for advanced packaging. It is part of the broader CHIPS National Advanced Packaging Manufacturing Program and focuses on developing new materials and processes to enhance U.S. leadership in microelectronics.
Project Information FAQ
Project Information
Want to explore the full details? View the full report
Participants
Sponsoring Agency | Obfuscated Data |
Company | Obfuscated Data |
Status
Original status | Awarded |
Taiyo status | Obfuscated Data |
Taiyo last update | 00-00-0000 |
Available timestamps | 00-00-0000 |
Available timestamp type | Obfuscated Data |
Contact
Contact name | Obfuscated Data |
Phone | 0000000000 |
ObfuscatedData@email.com | |
Address | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Description
Description | The SHIELD USA project aims to strengthen U.S. semiconductor packaging capabilities by driving innovation in the domestic microchip packaging ecosystem and expanding capacity for advanced packaging. It is part of the broader CHIPS National Advanced Packaging Manufacturing Program and focuses on developing new materials and processes to enhance U.S. leadership in microelectronics. |
Original sub-sector | Obfuscated |
Original Currency | USD |
Original budget | 000000000000000 |
Procurement method | Obfuscated Data |
Budget | 000000000000000 |
Location
Region | Obfuscated |
Country | Obfuscated |
State | Obfuscated Data |
County | Obfuscated |
Location | Obfuscated Data, Obfuscated data, obfuscated data, Obfuscated data |
Source
Source reliability | High |
Data quality score | 100% |
Source | Obfuscated Data |
URL | obfuscated_data,obfuscateddata.com |
More Details
Project Type | Obfuscated Data |
Article Published Date | Obfuscated Data |