SK hynix HBM Chip Advanced Packaging & R&D Facility
Sector: Advanced Electronics • Location: West Lafayette, Indiana, United States of America
Source: Dodge USA
Advanced packaging fabrication and R&D 430,000 sf facility for next-generation HBM (High-Bandwidth Memory) chips. At the Purdue Research Park, on 90 acres with an option to expand to 30 more acres. Will collaborate with Purdue U for R&D. To be an advanced semiconductor production line to mass-produce next-generation HBM, the highest-performing Dynamic Random Access Memory (DRAM) chips, critical co
- Status
- Prospective
- Sector
- Advanced Electronics, Broadband, Car parking, Commercial, Manufacturing (Industrial), Rail, Automotive, Power Generation (CCGT), Telecommunications
- Location
- West Lafayette, Indiana, United States of America
- Updated
- 22 Jul 2026
- Source
- Dodge USA
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Project Information
Participants
| Not available for this record. |
Status
Original status | Pre-Design |
Taiyo status | Prospective |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | Advanced packaging fabrication and R&D 430,000 sf facility for next-generation HBM (High-Bandwidth Memory) chips. At the Purdue Research Park, on 90 acres with an option to expand to 30 more acres. Will collaborate with Purdue U for R&D. To be an advanced semiconductor production line to mass-produce next-generation HBM, the highest-performing Dynamic Random Access Memory (DRAM) chips, critical components of graphic processing units that train AI systems such as ChatGPT. |
Budget |
Location
Country | United States of America (USA) |
State | Indiana |
City | West Lafayette |
Source
Source | Dodge USA |
URL |
More Details
Record type | Project |
Sector | Advanced Electronics, Broadband, Car parking, Commercial, Manufacturing (Industrial), Rail, Automotive, Power Generation (CCGT), Telecommunications |
Article published date | 2024-04-15 |
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