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SK hynix HBM Chip Advanced Packaging & R&D Facility

Sector: Manufacturing (Industrial) • Location: West Lafayette, Indiana, United States of America

Source: Dodge USA

Project
Pre-Design

Advanced packaging fabrication and R&D 430,000 sf facility for next-generation HBM (High-Bandwidth Memory) chips. At the Purdue Research Park, on 90 acres with an option to expand to 30 more acres. Will collaborate with Purdue U for R&D. To be an advanced semiconductor production line to mass-produce next-generation HBM, the highest-performing Dynamic Random Access Memory (DRAM) chips, critical co

Status
Prospective
Sector
Manufacturing (Industrial), Car parking, Broadband, Automotive, Commercial, Rail, Advanced Electronics, Telecommunications
Location
West Lafayette, Indiana, United States of America
Updated
22 Jul 2026
Source
Dodge USA

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Project Information

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The project “SK hynix HBM Chip Advanced Packaging & R&D Facility” is an infrastructure initiative in the Manufacturing (Industrial) sector, located in West Lafayette, Indiana, United States of America. Taiyo aggregates data on it from Dodge USA.

Participants

Not available for this record.

Status

Original status

Pre-Design

Taiyo status

Prospective

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

Advanced packaging fabrication and R&D 430,000 sf facility for next-generation HBM (High-Bandwidth Memory) chips. At the Purdue Research Park, on 90 acres with an option to expand to 30 more acres. Will collaborate with Purdue U for R&D. To be an advanced semiconductor production line to mass-produce next-generation HBM, the highest-performing Dynamic Random Access Memory (DRAM) chips, critical components of graphic processing units that train AI systems such as ChatGPT.

Budget

Location

Country

United States of America (USA)

State

Indiana

City

West Lafayette

Source

Source

Dodge USA

URL

More Details

Record type

Project

Sector

Manufacturing (Industrial), Car parking, Broadband, Automotive, Commercial, Rail, Advanced Electronics, Telecommunications

Article published date

2025-01-06

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