logo

Stability Under Process Variability for Advanced Interconnects and Devices Beyond 7 nm node

Sector: Geothermal • Location: Germany, United Kingdom, France, Austria

Source: EU Funding & Tenders Portal

Project
Ended

Among the physical limitations which challenge progress in nanoelectronics for aggressively scaled More Moore, process variability is getting ever more critical. Effects from various sources of process variations, both systematic and stochastic, influence each other and lead to variations of the electrical, thermal and mechanical behavior of devices, interconnects and circuits. Correlations are of

Status
Closed
Sector
Geothermal, Manufacturing (Industrial), Education, Electric Vehicles (EVs), Automotive, Government
Location
Germany, United Kingdom, France, Austria
Updated
22 Jul 2026
Source
EU Funding & Tenders Portal

ConstructChat

Ask ConstructChat about Stability Under Process Variability for Advanced Interconnects and Devices Beyond 7 nm node

Pick a question to edit it, or write your own.

First answer free · no account

I am a

Project Information FAQ

Project Information

4 Q
The project “Stability Under Process Variability for Advanced Interconnects and Devices Beyond 7 nm node” is an infrastructure initiative in the Geothermal sector, located in Germany, United Kingdom, France, Austria. Taiyo aggregates data on it from EU Funding & Tenders Portal.

Participants

Sponsoring Agency

Status

Original status

ended

Taiyo status

Closed

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

Among the physical limitations which challenge progress in nanoelectronics for aggressively scaled More Moore, process variability is getting ever more critical. Effects from various sources of process variations, both systematic and stochastic, influence each other and lead to variations of the electrical, thermal and mechanical behavior of devices, interconnects and circuits. Correlations are of key importance because they drastically affect the percentage of products which meet the specifications. Whereas the comprehensive experimental investigation of these effects is largely impossible, modelling and simulation (TCAD) offers the unique possibility to predefine process variations and trace their effects on subsequent process steps and on devices and circuits fabricated, just by changing the corresponding input data. This important requirement for and capability of simulation is among others highlighted in the International Technology Roadmap for Semiconductors ITRS. SUPERAID7 will build upon the successful FP7 project SUPERTHEME which focused on advanced More-than-Moore devices, and will establish a software system for the simulation of the impact of systematic and statistical process variations on advanced More Moore devices and circuits down to the 7 nm node and below, including especially interconnects. This will need improved physical models and extended compact models. Device architectures addressed in the benchmarks include especially TriGate/ΩGate FETs and stacked nanowires, including alternative channel materials. The software developed will be benchmarked utilizing background and sideground experiments of the partner CEA. Main channels for exploitation will be software commercialization via the partner GSS and support of device architecture activities at CEA. Furthermore, an Industrial Advisory Board initially consisting of GLOBALFOUNDRIES and STMicroelectronics will contribute to the specifications and will get early access to the project results.

Location

Country

Germany, United Kingdom, France, Austria

Source

Source

EU Funding & Tenders Portal

URL

More Details

Record type

Project

Sector

Geothermal, Manufacturing (Industrial), Education, Electric Vehicles (EVs), Automotive, Government

Article published date

2026-01-15

More on this project

Research

Free account

View all details

You are reading the public part. A free account opens the rest:

  • Every detail on this project
  • News and media coverage
  • Technical research
View all details

Free account · no card · lands you back on this project