Substrate Manufacturing Technology Facility in Bhubaneswar
Sector: Advanced Electronics • Location: Bhubaneswar, Odisha, India
Source: The Times of India
Odisha government signed an MoU with Intel Corporation and 3DGS Inc USA to establish a substrate manufacturing technology facility in Bhubaneswar, India. The project involves advanced packaging glass core substrates and high-density interconnect substrates, with Intel providing technology know-how. It aims to boost semiconductor ecosystem development, generate over 1,800 direct high-skilled jobs,
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Status
Original status | planned |
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Description
Description | Odisha government signed an MoU with Intel Corporation and 3DGS Inc USA to establish a substrate manufacturing technology facility in Bhubaneswar, India. The project involves advanced packaging glass core substrates and high-density interconnect substrates, with Intel providing technology know-how. It aims to boost semiconductor ecosystem development, generate over 1,800 direct high-skilled jobs, and enhance export-oriented manufacturing. The project will be implemented in phases over 5-6 years. |
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Original Currency | USD |
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