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Texas Instruments Sherman Mega-Site Semiconductor Manufacturing Expansion

Sector: Advanced Electronics • Location: Sherman and Lehi, Texas and Utah, United States

Source: The Globe and Mail

Project
Under Construction

Texas Instruments plans to invest over $60 billion to expand its domestic semiconductor manufacturing footprint, including a new mega-site in Sherman, Texas with four 300mm wafer fabrication plants. The first fab, SM1, is expected to begin production in 2025, SM2 is structurally complete, and SM3 and SM4 are in early planning stages. The expansion also includes facilities in Lehi, Utah, aimed at m

Status
Under Construction
Sector
Advanced Electronics, Manufacturing (Industrial)
Location
Sherman and Lehi, Texas and Utah, United States of America
Updated
22 Jul 2026
Source
The Globe and Mail

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The project “Texas Instruments Sherman Mega-Site Semiconductor Manufacturing Expansion” is an infrastructure initiative in the Advanced Electronics sector, located in Sherman and Lehi, Texas and Utah, United States. Taiyo aggregates data on it from The Globe and Mail.

Participants

Not available for this record.

Status

Original status

under construction

Taiyo status

Under Construction

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

Texas Instruments plans to invest over $60 billion to expand its domestic semiconductor manufacturing footprint, including a new mega-site in Sherman, Texas with four 300mm wafer fabrication plants. The first fab, SM1, is expected to begin production in 2025, SM2 is structurally complete, and SM3 and SM4 are in early planning stages. The expansion also includes facilities in Lehi, Utah, aimed at meeting growing demand for analog and embedded processing chips.

Original sector

Semiconductor Manufacturing

Budget

Location

Country

United States of America (USA)

State

Texas and Utah

City

Sherman and Lehi

Source

Source

The Globe and Mail

URL

More Details

Record type

Project

Sector

Advanced Electronics, Manufacturing (Industrial)

Article published date

2025-06-22

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