TSMC Advanced Chip Packaging Plant in Arizona
Sector: Advanced Electronics • Location: Phoenix, Arizona, United States
Source: The National Interest
Taiwan Semiconductor Manufacturing Company (TSMC) is constructing an advanced chip packaging plant in Arizona, set to open by 2029. This is part of a broader investment to expand semiconductor manufacturing capacity in the United States, particularly in Arizona, which is becoming a major chip hub. The project includes at least three fabs, two advanced packaging facilities, and a Research & Develop
- Status
- Under Construction
- Sector
- Advanced Electronics, Manufacturing (Industrial)
- Location
- Phoenix, Arizona, United States of America
- Updated
- 22 Jul 2026
- Source
- The National Interest
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Project Information
Participants
| Not available for this record. |
Status
Original status | under construction |
Taiyo status | Under Construction |
Taiyo last update | 2026-07-22 |
Contact
| Not available for this record. |
Description
Description | Taiwan Semiconductor Manufacturing Company (TSMC) is constructing an advanced chip packaging plant in Arizona, set to open by 2029. This is part of a broader investment to expand semiconductor manufacturing capacity in the United States, particularly in Arizona, which is becoming a major chip hub. The project includes at least three fabs, two advanced packaging facilities, and a Research & Development center, aiming to produce advanced chips smaller than seven nanometers. |
Original sector | Manufacturing |
Budget |
Location
Country | United States of America (USA) |
State | Arizona |
City | Phoenix |
Source
Source | The National Interest |
URL |
More Details
Record type | Project |
Sector | Advanced Electronics, Manufacturing (Industrial) |
Article published date | 2026-05-23 |
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