TSMC Arizona Semiconductor Manufacturing Expansion

under construction

Taiwan Semiconductor Manufacturing Company (TSMC) has increased its investment in Arizona to $265 billion across 12 facilities, including 10 wafer fabs, two advanced packaging facilities, and an R&D center. The expansion includes dedicated CoWoS advanced packaging capacity to address AI accelerator supply bottlenecks. Fab 21 Phase 1 is already in volume production of 4nm chips, with Phase 2 targeting 3nm and 2nm production, and a third fab targeting 2nm and A16 process nodes. Four additional fabs targeting 2nm and below process technologies and CoWoS packaging capacity were announced, with construction timelines to track customer demand. The project aims to locate approximately 30% of TSMC's 2nm and more advanced global capacity in Arizona.