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TSMC Phoenix Wafer-Fabs Expansion

Sector: Advanced Electronics • Location: Phoenix, Arizona, United States

Source: The Business Journals

Project
Under Construction

Taiwan Semiconductor Manufacturing Company (TSMC) is investing an estimated $165 billion to build six new wafer fabrication plants (fabs) on a 1,100-acre site in North Phoenix. These are highly complex factories requiring significant electrical power, ultrapure water, and precision machinery. The project is the largest single foreign industrial investment in U.S. history and is projected to create

Status
Under Construction
Sector
Advanced Electronics, Water Supply and Storage, Manufacturing (Industrial), Power Generation (CCGT)
Location
Phoenix, Arizona, United States of America
Updated
22 Jul 2026
Source
The Business Journals

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The project “TSMC Phoenix Wafer-Fabs Expansion” is an infrastructure initiative in the Advanced Electronics sector, located in Phoenix, Arizona, United States. Taiyo aggregates data on it from The Business Journals.

Participants

Not available for this record.

Status

Original status

under construction

Taiyo status

Under Construction

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Description

Taiwan Semiconductor Manufacturing Company (TSMC) is investing an estimated $165 billion to build six new wafer fabrication plants (fabs) on a 1,100-acre site in North Phoenix. These are highly complex factories requiring significant electrical power, ultrapure water, and precision machinery. The project is the largest single foreign industrial investment in U.S. history and is projected to create thousands of high-tech jobs and generate over $33 billion in economic output for Arizona.

Original sector

Technology

Budget

Location

Country

United States of America (USA)

State

Arizona

City

Phoenix

Source

Source

The Business Journals

URL

More Details

Record type

Project

Sector

Advanced Electronics, Water Supply and Storage, Manufacturing (Industrial), Power Generation (CCGT)

Article published date

2025-11-03

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