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Wearable Applications enabled by electronic Systems on Paper

Sector: Forest Products and Packaging • Location: Italy, United Kingdom, Germany, Spain, Switzerland

Source: EU Funding & Tenders Portal

Project
Ended

The WASP project aims at bringing the much-needed step change in flexible and wearable electronics by developing a new industrially driven enabling printing technology for the definition of electronic devices and circuits on paper, a flexible and foldable substrate, which is low cost, disposable, biodegradable, easily obtainable in nature and compatible with high speed roll-to-roll processes. The

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The project “Wearable Applications enabled by electronic Systems on Paper” is an infrastructure initiative in the Forest Products and Packaging sector, located in Italy, United Kingdom, Germany, Spain, Switzerland. Taiyo aggregates data on it from EU Funding & Tenders Portal.

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Description

Description

The WASP project aims at bringing the much-needed step change in flexible and wearable electronics by developing a new industrially driven enabling printing technology for the definition of electronic devices and circuits on paper, a flexible and foldable substrate, which is low cost, disposable, biodegradable, easily obtainable in nature and compatible with high speed roll-to-roll processes. The proposed technology is based on an environmentally friendly process and addresses the needs for future circular economy, as well as that for cheap, flexible and lightweight, multi-functional electronics. At the end of the project, a demonstrator will be released, able to sense biometric parameters (i.e., humidity, pH, glucose levels) and to communicate to an external reader, developed on purpose within the WASP activity.

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High

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100%

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