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200 mm wafer coating and developing track tool DUV

Sector: Road • Location: Espoo, Finland

Source: TED Europa

Tender
Contract Notice

THE OBJECT OF THE TENDER PROCESS

The object of the procurement is 200 mm wafer coating and developing track tool for VTT Micronova cleanroom semiconductor front end processing. The procurement involves a tool integrated into a DUV exposure tool, but also capable of developing wafers from the i-line stepper in the same facility. The tool features open cassette loading stations, spin coating and de

Status
Closed
Sector
Road, Advanced Electronics
Location
Espoo, Finland
Updated
3 Nov 2026
Source
TED Europa

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Tender Information

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The tender “200 mm wafer coating and developing track tool DUV” is a tender record in Taiyo, linked to the Road sector. It is issued for works, goods, or services related to Espoo, Finland.

Participants

Not available for this record.

Status

Original status

contract notice

Taiyo status

Closed

Taiyo last update

2026-11-03

Contact

Not available for this record.

Description

Description

THE OBJECT OF THE TENDER PROCESS The object of the procurement is 200 mm wafer coating and developing track tool for VTT Micronova cleanroom semiconductor front end processing. The procurement involves a tool integrated into a DUV exposure tool, but also capable of developing wafers from the i-line stepper in the same facility. The tool features open cassette loading stations, spin coating and developing stations and hot and cool plates, and a module for integration with the DUV exposure tool. The tool also should have an option of extracting processed wafers in open cassettes. The coating and developing track tool is intended to support silicon semiconductor front end processing of 200 mm wafers, facilitating exposure by DUV stepper or other exposure tool. To this end, it must be capable of priming wafers with HMDS, coating wafers with DUV resist and with BARC, and developing DUV and i-line types of exposed resist, with the associated heating and cooling arrangements. The technical specification of the object of the tender is described in more detail in this Annex 1 of the invitation to tender. The tendered Tool must comply with all technical properties and functionalities, performance specifications and acceptance criteria as set out in Annex 1 and Annex 2 (“Facilities, materials and connector types”). A tender which does not meet one or more of the requirements specified in the Annex 1 and Annex 2, may be rejected for failing to comply with the call for tenders. The comparison criterion for the tenders is economic advantageous (see section "Grounds for decision") with 80 % price weighting and 20 % quality weighting. A reference price has to be given for the equipment that meets all the requirements set in the invitation to tender, especially its Annex 1. The object of the tender process is described in more detail in the invitation to tender documents. Partial tenders will not be accepted. OPTIONS (mandatory) The following are mandatory options (to be offered): - Maintenance contract (See section Maintenance contract option). VTT does not commit to purchase the options. The price(s) of the option(s) are not taken into account when comparing tenders.

Original sector

Laboratory, optical and precision equipments (excl. glasses)

Location

Country

Finland

City

Espoo

Source

Source

TED Europa

URL

More Details

Record type

Tender

Sector

Road, Advanced Electronics

Article published date

2025-12-19

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