2026 Chip Seal and Wedge Bid Specifications

2026-11-03

The chip sealing process expected through these specifications will consist of a heavy single seal of MS5 hot asphalt and a 100 % fractured 3 / 8 granite blackstone which shall not exceed 3 / 8 ” in size . Both asphalt and aggregate shall be applied to one half of the roadway at a time to allow for continuous flow of traffic . The asphalt emulsion shall be applied at a minimum of 170 degrees and be evenly distributed by a spray distributor . The road surface shall be cleaned by a self - propelled broom and any necessary cold mix patching installed prior to chip sealing . The finished chip seal shall be rolled and set in place with a duo packer roller . Cold or hot mix asphalt for wedge patching will be produced using asphalt and a crushed stone and washed sand aggregate mixture with a top size not exceeding 1 / 2 ”. A separate bid item is shown for wedging and the roads requiring wedging are identified . Estimates of material needed for wedging is provided for guidance . The Town will be responsible for payment of material actually used . Patching and pot hole filling shall be included in price . The Town will mark the areas required to be patched prior to chip sealing . Pot holes are incidental . This shall be completed after the crack filling .

Wisconsin

2026-05-06