300 mm Wafer Dry-in/Dry-out CMP system 1 Set
Prospective · Kanagawa
Source: Japan External Trade Organization (JETRO)
Classification of the products to be procured : 2 Nature and quantity of the products to be purchased : 30 mm Wafer Dry-in/Dry-out CMP system Set Type of the procurement : Purchase Basi requirements of the procurement : The equipment shall be equipped with two or more polishing units compatible with 30 mm wafers. It shall support both metal and non-metal polishing and shall be equipped with an au
- Status
- Prospective
- Sector
- Education, Metal
- Location
- Kanagawa, Japan
- Updated
- 3 Nov 2026
- Source
- Japan External Trade Organization (JETRO)
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Tender Information
Participants
| Not available for this record. |
Status
Original status | prospective |
Taiyo status | Prospective |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | Classification of the products to be procured : 2 Nature and quantity of the products to be purchased : 30 mm Wafer Dry-in/Dry-out CMP system Set Type of the procurement : Purchase Basi requirements of the procurement : The equipment shall be equipped with two or more polishing units compatible with 30 mm wafers. It shall support both metal and non-metal polishing and shall be equipped with an automati slurry supply system. Time limit for the submission of the requested material : 1 : 0 3 November, 202 Contact point for the notice : SUGI YAMA Eriko, Accounting and Contract Division, Finance Department, National University Corporation Yokohama National University, 79- Tokiwadai Hodogaya-ku Yokohama-shi 240-850 Japan, TEL 045-339-324 E-Mail : keiri.keiyaku1@ynu.ac.jp |
Location
Country | Japan |
State | Kanagawa |
Source
Source | Japan External Trade Organization (JETRO) |
URL |
More Details
Record type | Tender |
Sector | Education, Metal |
Article published date | 2026-11-03 |
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