How can I verify the tender source and access bidding documents for “3D Quantum Tunneling Integrated Circuit Chip Manufacturing Equipment 1 set”?

Taiyo’s tender pages link back to the originating system via https://www.jetro.go.jp/en/database/procurement/national/articles/379679/2026012200450000.html, referencing Japan External Trade Organization (JETRO) as the source. Users can follow the official link to download tender documents and submission instructions.

3D Quantum Tunneling Integrated Circuit Chip Manufacturing Equipment 1 set

Q: What is the current bidding status of the tender “3D Quantum Tunneling Integrated Circuit Chip Manufacturing Equipment 1 set”?

The status recorded for “3D Quantum Tunneling Integrated Circuit Chip Manufacturing Equipment 1 set” is closed.

One of 10,000+ tenders Taiyo tracks in Japan.

Source: Japan External Trade Organization (JETRO)

Tender

Closed

Classification of the products to be procured : 2 Nature and quantity of the products to be purchased : 3D Quantum Tunneling Integrated Circuit Chi Manufacturing Equipment set Time limit for the submission of comments : 1 : 0 1 February, 202 Contact point for the notice : TOBIOKA Naoki, Procurement Section, Procurement Division, Hokkaido University, Kita Nishi Kita-ku Sapporo-shi 060-080 Japan,

Status: Closed
Sector: Manufacturing (Industrial), Education
Location: Japan
Updated: 3 Nov 2026
Source: Japan External Trade Organization (JETRO)

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Tender Information

3 Q

The tender “3D Quantum Tunneling Integrated Circuit Chip Manufacturing Equipment 1 set” is a tender record in Taiyo, linked to the Manufacturing (Industrial) sector. It is issued for works, goods, or services related to Japan.

Participants

Not available for this record.

Status

Original status	closed
Taiyo status	Closed
Taiyo last update	2026-11-03

Contact

Not available for this record.

Description

Location

Country

Japan

Source

Source	Japan External Trade Organization (JETRO)
URL

More Details

Record type	Tender
Sector	Manufacturing (Industrial), Education
Article published date	2026-03-26

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3D Quantum Tunneling Integrated Circuit Chip Manufacturing Equipment 1 set

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