Amendment 1 to Automatic Wire Bonder

2026-11-03

AMENDMENT 1 TO SOLICITATION 1333ND26QNB030043 Due to Vendor Questions : Vendor Question 1 : Can you let me know if the parts will be held on flat boats or manually placed on the workholder ? NIST Response : The samples ( chips ) need to be wire bonder to a 256 - pin ceramic package . This ceramic package needs to be affixed to the stage of the bonder for wire bonding . Vendor Question 2 : Current Equipment : Are you currently using a manual wire bonder ? If so , could you specify the make and model ? NIST Response : NoVendor Question 3 : Application : What type of bonding applications do you plan to run with the new wire bonder ? NIST Response : We are looking to bond a 1 cm2 chip inside a 256 - pin double - tiered ceramic package and streamline the processVendor Question 4 : Bonding Tools : Are there specific bonding tools or configurations required for your applications ? NIST Response : You will find this information in the Statement of Work . Vendor Question 5 : Accessories : Will you need additional items such as a microscope , work holders , or any other accessories ? NIST Response : The tool should contain a scope for inspection and a way to fix the sample piece to the stage . As described in the attached Combined Synopsis Solicitation , Statement of Work and Applicable Provisions and Clauses

Maryland

2026-04-08