Amendment 1 To Automatic Wire Bonder

combined synopsis/solicitation

Closed

AMENDMENT 1 TO SOLICITATION 1333ND26QNB030043 Due to Vendor Questions: Vendor Question 1: Can you let me know if the parts will be held on flat boats or manually placed on the workholder? NIST Response: The samples (chips) need to be wire bonder to a 256-pin ceramic package. This ceramic package needs to be affixed to the stage of the bonder for wire bonding. Vendor Question 2: Current Equipment: Are you currently using a manual wire bonder? If so, could you specify the make and model? NIST Response: No Vendor Question 3: Application: What type of bonding applications do you plan to run with the new wire bonder? NIST Response: We are looking to bond a 1 cm2 chip inside a 256-pin double-tiered ceramic package and streamline the process Vendor Question 4: Bonding Tools: Are there specific bonding tools or configurations required for your applications? NIST Response: You will find this information in the Statement of Work. Vendor Question 5: Accessories: Will you need additional items such as a microscope, work holders, or any other accessories? NIST Response: The tool should contain a scope for inspection and a way to fix the sample piece to the stage. As described in the attached Combined Synopsis Solicitation, Statement of Work and Applicable Provisions and Clauses

United States of America (USA)

Maryland

SAM.gov

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Advanced Electronics, Commercial, Residential, Manufacturing (Industrial)