Blade Dicing Saw
Sector: Advanced Electronics • Location: European Union
Source: TED Europa
DTU Nanolab intends to procure a semi-automatic wafer dicing system for research and cleanroom operations. The equipment must be capable of processing wafers up to 300 mm diameter and support conventional wafer dicing, circular wafer cutting, multi-circular cutting, and edge trimming of circularly cut wafers to improve mechanical strength and handling robustness. The system must also be capable of
- Status
- Closed
- Sector
- Advanced Electronics, Manufacturing (Industrial), Education
- Location
- Unknown (Europe)
- Updated
- 3 Nov 2026
- Source
- TED Europa
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Tender Information
Participants
| Not available for this record. |
Status
Original status | contract award notice |
Taiyo status | Closed |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | DTU Nanolab intends to procure a semi-automatic wafer dicing system for research and cleanroom operations. The equipment must be capable of processing wafers up to 300 mm diameter and support conventional wafer dicing, circular wafer cutting, multi-circular cutting, and edge trimming of circularly cut wafers to improve mechanical strength and handling robustness. The system must also be capable of processing hard and thick materials used in advanced microfabrication and semiconductor research, including materials such as silicon carbide (SiC) and piezoelectric substrates. The equipment will be installed and operated in DTU Nanolab's multi-user cleanroom environment and will support research, innovation, and industrial collaboration activities. |
Original sector | Laboratory, optical and precision equipments (excl. glasses) |
Location
Country | Unknown (Europe) |
Source
Source | TED Europa |
URL |
More Details
Record type | Tender |
Sector | Advanced Electronics, Manufacturing (Industrial), Education |
Article published date | 2026-08-24 |
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