CHIPS High - Throughput High - Resolution X - ray Laminography / Tomography System for Advanced Packaged Semiconductor Devices and Substrates

2026-11-03

Amendment 0001 : Amendment changes include the following : The required response date is extended from February 26 , 2026 to March 9 , 2026No Statement of work changeQuestions and Answers : Question1 : Is there a cleanroom specification ? NIST Response : No . The instrument will be installed in a general purpose lab in the advanced measurement laboratory facility , but not within a cleanroom . Question 2 : Are you flexible on the footprint ( size / dimension ) NIST Response : NIST expects the analytical instrument ( source , stages , detectors , and shielded enclosure ) to fit within the footprint specified by 10 . 2 . Additional space is available in the lab around the instrument for service access , and for support equipment ( including chase space for air compressor / dryer if required , and a work area in the lab for control and analysis PCs ). Question 3 : Are the devices in JEDEC Trays ? NIST Response : Typically no . NIST requires significant flexibility to load samples that are within the size envelope described by specification 5 . Samples will include full wafers , coupons ( partial wafers ), individual or groups of packaged devices , as well as atypical sample geometries . To meet requirement 5 . 1 , vendors must include 5 sample carriers that are compatible with the automated loading system . Carriers supporting a JEDEC tray is only one possible way to meet that requirement . See Combined Synopsis Solicitation_1333ND26QNB030031 , Attachment 1 - Statement of Work , and Attachment 2 - Applicable Provisions and Clauses attachments for solicitation details .

Maryland

2026-05-02