Clustertool for Ion Beam Etching of 300mm wafers
Contract notice · Germany · Last reported Feb 2026
Source: TED Europa
The tender item is an ion beam etching process tool to be used for 300mm wafer fabrication at the FRAUNHOFER IPMS. The systems will be used for the processing of CMOS wafers in a cleanroom class 1000 (approximately class 6 EN ISO 14644-1) production environment. Therefore, it is necessary to fulfill require-ments regarding metal contamination and particle generation compatible with industry standa
- Status
- Closed
- Sector
- Metal, Manufacturing (Industrial)
- Location
- Germany
- Updated
- 3 Nov 2026
- Source
- TED Europa
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Tender Information
Participants
| Not available for this record. |
Status
Original status | contract notice |
Taiyo status | Closed |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | The tender item is an ion beam etching process tool to be used for 300mm wafer fabrication at the FRAUNHOFER IPMS. The systems will be used for the processing of CMOS wafers in a cleanroom class 1000 (approximately class 6 EN ISO 14644-1) production environment. Therefore, it is necessary to fulfill require-ments regarding metal contamination and particle generation compatible with industry standards. |
Original sector | Industrial machinery |
Location
Country | Germany |
Source
Source | TED Europa |
URL |
More Details
Record type | Tender |
Sector | Metal, Manufacturing (Industrial) |
Article published date | 2026-03-07 |
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