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CMP Anlage

Contract notice · Germany · Last reported Apr 2026

Source: TED Europa

Tender
Contract Notice

Anlage zum Planarisieren und Glätten von Oberflächen mittels chemisch-mechanischem Polieren (CMP, chemical mechanical polishing) zur Prozessierung von bis zu 6 Zoll großen Substraten

Status
Closed
Sector
Education, Road, Chemical (Industrial), Manufacturing (Industrial)
Location
Siegen, Germany
Updated
3 Nov 2026
Source
TED Europa

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Tender Information

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The tender “CMP Anlage” is a tender record in Taiyo, linked to the Education sector. It is issued for works, goods, or services related to Siegen, Germany.

Participants

Not available for this record.

Status

Original status

contract notice

Taiyo status

Closed

Taiyo last update

2026-11-03

Contact

Not available for this record.

Description

Description

Anlage zum Planarisieren und Glätten von Oberflächen mittels chemisch-mechanischem Polieren (CMP, chemical mechanical polishing) zur Prozessierung von bis zu 6 Zoll großen Substraten

Original sector

Industrial machinery, Laboratory, optical and precision equipments (excl. glasses), Industrial machinery

Location

Country

Germany

City

Siegen

Source

Source

TED Europa

URL

More Details

Record type

Tender

Sector

Education, Road, Chemical (Industrial), Manufacturing (Industrial)

Article published date

2026-04-08

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