CMP Anlage
Sector: Chemical (Industrial) • Location: Siegen, Germany
Source: TED Europa
Anlage zum Planarisieren und Glätten von Oberflächen mittels chemisch-mechanischem Polieren (CMP, chemical mechanical polishing) zur Prozessierung von bis zu 6 Zoll großen Substraten
- Status
- Closed
- Sector
- Chemical (Industrial), Education, Manufacturing (Industrial), Road
- Location
- Siegen, Germany
- Updated
- 3 Nov 2026
- Source
- TED Europa
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Tender Information
Participants
| Not available for this record. |
Status
Original status | contract award notice |
Taiyo status | Closed |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | Anlage zum Planarisieren und Glätten von Oberflächen mittels chemisch-mechanischem Polieren (CMP, chemical mechanical polishing) zur Prozessierung von bis zu 6 Zoll großen Substraten |
Original sector | Laboratory, optical and precision equipments (excl. glasses), Industrial machinery, Industrial machinery |
Budget |
Location
Country | Germany |
City | Siegen |
Source
Source | TED Europa |
URL |
More Details
Record type | Tender |
Sector | Chemical (Industrial), Education, Manufacturing (Industrial), Road |
Article published date | 2026-07-03 |
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