Deep Reaction Ion Etcher (DRIE)
Sector: Industrial machinery • Location: Sweden
Source: TED Europa
Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of p
- Status
- Closed
- Sector
- Industrial machinery
- Location
- Sweden
- Updated
- 3 Nov 2026
- Source
- TED Europa
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Tender Information
Participants
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Status
Original status | contract notice |
Taiyo status | Closed |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning. |
Original sector | Industrial machinery |
Location
Country | Sweden |
Source
Source | TED Europa |
URL |
More Details
Record type | Tender |
Article published date | 2026-11-03 |
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