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Delphi

Sector: Advanced Electronics • Location: United States of America

Source: SAM.gov

Tender
Solicitation

Amendment 1 Issued: April 30, 2026 This amendment to the Dephi ISO changes the following: 1) APPENDIX C_Proposal Format And Instructions_Delphi: Updates to section 1.3 and links (highlighted in yellow) 2) APPENDIX C.1_Technical and Management Proposal_Dephi: Updates to section 6 (highlighted in yellow) 3) APPENDIX C.4_Price Proposal Spreadsheet_Dephi: Updates to the labor worksheet 4) APPENDIX E_M

Status
Prospective
Sector
Advanced Electronics, Power Generation (CCGT), Commercial, Residential, Hospital
Location
United States of America
Updated
3 Nov 2026
Source
SAM.gov

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Tender Information

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The tender “Delphi” is a tender record in Taiyo, linked to the Advanced Electronics sector. It is issued for works, goods, or services related to United States of America.

Participants

Not available for this record.

Status

Original status

solicitation

Taiyo status

Prospective

Taiyo last update

2026-11-03

Contact

Not available for this record.

Description

Description

Amendment 1 Issued: April 30, 2026 This amendment to the Dephi ISO changes the following: 1) APPENDIX C_Proposal Format And Instructions_Delphi: Updates to section 1.3 and links (highlighted in yellow) 2) APPENDIX C.1_Technical and Management Proposal_Dephi: Updates to section 6 (highlighted in yellow) 3) APPENDIX C.4_Price Proposal Spreadsheet_Dephi: Updates to the labor worksheet 4) APPENDIX E_Model OT: Updated to correct formatting No other changes to this ISO have been made as a result of this amendment. (end) ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Solution Summary due date: Wednesday, April 8, 2026 at 5:00PM ET. A solution summary is required in order to submit a proposal. The Delphi Program vision is to empower all Americans to fully understand their own bodies with continuous monitoring of deep biological information—hormones, cytokines, and drug levels. Leveraging chiplets, a new system architecture in microelectronics, will greatly decrease cost, reduce size, weight, and power (SWaP), and enable all developers to access cutting edge capabilities. By the end, Delphi will quickly and cheaply develop modular wearable or ingestible sensors for monitoring a broad range of biological markers. The benefits include 1) early detection to prevent disease progression, 2) continuous monitoring for safe home recovery, and 3) precision, closed-loop monitoring of therapies for superior outcomes. Delphi will improve the biosensor development ecosystem, enabling low-cost but high performance sensing by shifting to a chiplet-based architecture. With chiplets, components of what would typically be an Application Specific Integrated Circuit (ASIC) can be reused and remixed into new devices that share the same high performance. Yields and scaling tend to be easier, and the approach inherently enables heterogeneous integration, which is ideal due to the diverse material set often needed for biosensing. Delphi aims to leverage existing advances in chiplets to focus on the components specific to biosensing. First, dry, hermetically sealed chiplets must provide ultra-low power management, overcoming the limitations of current power-hungry standards and the constraints of low duty cycle operation and RF or internal power harvesting. Additionally, chiplets that ensure secure communication of medical data from these body-worn devices must be developed. Second, “wet” biosensor chiplets that directly interface with biology are needed. Delphi aims to extend the state of art from biophysical measurements or high-concentration metabolites to the continuous measurement of low concentration biochemical markers such as hormones and cytokines over extended periods. Third, these chiplets must be integrated into biocompatible packages that are fully encapsulated except at the sensing interface. Existing encapsulation methods either lack the selectivity and reliability required at the chiplet scale or depend on rigid, complex, non-modular solutions. New packaging strategies must protect delicate electronics, preserve sensor surface chemistry, and support durable, long-term operation in biological environments.

Original sector

Professional, Scientific, and Technical Services

Location

Country

United States of America (USA)

Source

Source

SAM.gov

URL

More Details

Record type

Tender

Sector

Advanced Electronics, Power Generation (CCGT), Commercial, Residential, Hospital

Article published date

2026-05-01

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