Die Bonding System
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Source: Contracts Finder
Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation l
- Status
- Prospective
- Sector
- Education, Road
- Location
- United Kingdom
- Updated
- 3 Nov 2026
- Source
- Contracts Finder
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Tender Information
Participants
| Not available for this record. |
Status
Original status | opportunity |
Taiyo status | Prospective |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs. |
Location
Country | United Kingdom (UK) |
Source
Source | Contracts Finder |
URL |
More Details
Record type | Tender |
Sector | Education, Road |
Article published date | 2026-07-02 |
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