Edge-Handling Sputtering Cluster Tool
Sector: Advanced Electronics • Location: Finland
Source: TED Europa
The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”).
The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechani
- Status
- Closed
- Sector
- Advanced Electronics
- Location
- Finland
- Updated
- 3 Nov 2026
- Source
- TED Europa
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Tender Information
Participants
| Not available for this record. |
Status
Original status | contract notice |
Taiyo status | Closed |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents. |
Original sector | Laboratory, optical and precision equipments (excl. glasses) |
Location
Country | Finland |
Source
Source | TED Europa |
URL |
More Details
Record type | Tender |
Sector | Advanced Electronics |
Article published date | 2026-08-07 |
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