logo

EUV TRACK (HNA/LNA)

Sector: Advanced Electronics • Location: Belgium

Source: TED Europa

Tender
Contract Award Notice

The high NA - EUV track will support a High NA EUV scanner it gets linked to. The track will prepare the wafers before the exposure, this is pre-treatment of the wafers before coating, the coating of underlayer and photo resist followed by a post application bake. After exposure the track will execute the post exposure bake and development of the photo sensitive material to get the pattern fixed.

Status
Closed
Sector
Advanced Electronics, Commercial
Location
Belgium
Updated
3 Nov 2026
Source
TED Europa

ConstructChat

Ask ConstructChat about EUV TRACK (HNA/LNA)

Pick a question to edit it, or write your own.

First answer free · no account

I am a

Tender Information FAQ

Tender Information

3 Q
The tender “EUV TRACK (HNA/LNA)” is a tender record in Taiyo, linked to the Advanced Electronics sector. It is issued for works, goods, or services related to Belgium.

Participants

Not available for this record.

Status

Original status

contract award notice

Taiyo status

Closed

Taiyo last update

2026-11-03

Contact

Not available for this record.

Description

Description

The high NA - EUV track will support a High NA EUV scanner it gets linked to. The track will prepare the wafers before the exposure, this is pre-treatment of the wafers before coating, the coating of underlayer and photo resist followed by a post application bake. After exposure the track will execute the post exposure bake and development of the photo sensitive material to get the pattern fixed. The track modules need to be precisely controlled to achieve superior results in uniformity within the wafer and from wafer to wafer. It also needs to enable the processing of a wide variety of materials to support the further scaling and continuous evolving semiconductor devices. The low NA - EUV track will support a Low NA EUV scanner it gets linked to. The track will prepare the wafers before the exposure, this is pre-treatment of the wafers before coating, the coating of underlayer and photo resist followed by a post application bake. After exposure the track will execute the post exposure bake and development of the photo sensitive material to get the pattern fixed. The track modules need to be precisely controlled to achieve superior results in uniformity within the wafer and from wafer to wafer. It also needs to enable the processing of a wide variety of materials to support the further scaling and continuous evolving semiconductor devices.

Original sector

Laboratory, optical and precision equipments (excl. glasses)

Location

Country

Belgium

Source

Source

TED Europa

URL

More Details

Record type

Tender

Sector

Advanced Electronics, Commercial

Article published date

2026-10-02

More on this tender

Research

Free account

View all details

You are reading the public part. A free account opens the rest:

  • Every detail on this tender
  • News and media coverage
  • Technical research
View all details

Free account · no card · lands you back on this tender