Flip Chip Die Bonder
Sector: Road • Location: Darmstadt, Germany
Source: TED Europa
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
- Status
- Closed
- Sector
- Road, Geothermal, Telecommunications, Advanced Electronics, Education
- Location
- Darmstadt, Germany
- Updated
- 3 Nov 2026
- Source
- TED Europa
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Tender Information
Participants
| Not available for this record. |
Status
Original status | contract notice |
Taiyo status | Closed |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding. |
Original sector | Laboratory, optical and precision equipments (excl. glasses) |
Location
Country | Germany |
City | Darmstadt |
Source
Source | TED Europa |
URL |
More Details
Record type | Tender |
Sector | Road, Geothermal, Telecommunications, Advanced Electronics, Education |
Article published date | 2026-08-24 |
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